Selected recent publications of this group are listed below.

For a complete list of publications of a group member, please refer to his/her CV/resume, or contact him/her for more information.

The thesis or dissertations of the group members can be found in the ProQuest Digital Dissertations database.

Journal Publications

1. 2023-1. “Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model,” Y.Lai, J. Ha, K. Deo, J. Yang, P. Yin, S. Park, IEEE Transactions on Components,Packaging and Manufacturing Technology, vol. 13(1), pp. 127-134, 10.1109/TCPMT. 2023.3239304, 2023.
2. 2023-2. “Reflow Profiling with the Aid of Machine Learning Models,” Y. Lai, S. Park, Soldering and Surface Mount Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10.1108/SSMT-03-2023-0013, 2023.
3. 2023-3. “Enhanced Solder Fatigue Life of ChipResistor by Optimizing Solder Shape,” J. Ha, Y. Lai, J. Yang, P. Yin, S. Park, Microelectronics Reliability, vol. 145, 10.1016 /j.microrel.2023.114994, 2023.
4. 2023-4. “Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation,” P. Yin, S. Park, B. Jacob, A. Gowda, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10.1109/TCPMT. 2023.3281199, 2023.
5. 2022-1. “Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components,” Y. Lai, K. Pan, C. Cai, P. Yin, J. Yang, S. Park, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol 12(3), pp. 562-569, 2022.
6. 2022-2. “An Intelligent System for Reflow Oven Temperature Settings Based on Hybrid Physics-Machine Learning Method,” Y. Lai, K. Pan, Y. Cen, J. Yang, C. Cai, P. Yin, S. Park, Soldering & Surface Mount Technology, [DOI 10.1108/SSMT-10-2021-0063], 2022.
7. 2022-3. “In-Situ Temperature-Dependent Characterization of Copper Through Glass Via (TGV),” K. Pan, J. Xu, Y. Lai, S. Park, C. Okoro, D. Joshi, S. Pollard, Microelectronics Reliability, vol. 129, p. 114487, 2022.
8. 2021-1. “A Comparative Study of Thermal Fatigue Life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC Solder Alloy BGAs,” C. Cai, J. Xu, H. Wang, S. Park, Microelectronics Reliability, vol. 119, 2021.
9. 2021-2. “The Dissimilar Self-Alignment Characteristics of Smaller Passive Components in the Length and Width Directions,” J. He, Y. Cen, Y. Li, S. Park, D. Won, Journal of Surface Mount Technology, vol. 34, pp. 7-15, 2021.
10. 2020-1. “Accessible Determination of Die-to-Wafer Bond Strength with the Schwickerath Test,” S. Shao, Y. Niu, J. Wang, S. Park, Engineering Fracture Mechanics, vol. 229, 2020.
11. 2020-2. “A Comprehensive Solution for Modeling Moisture Induced Delamination in Electronic Packaging during Solder Reflow,” J. Wang, Y. Niu, S. Shao, H. Wang, J. Xu S. Park, Microelectronics Reliability, vol. 112, 2020.
12. 2020-3. “Design Guideline on Board-Level Thermomechanical Reliability of 2.5D Package,” S. Shao, Y. Niu, J. Wang, R. Liu, S. Park, H. Lee, L. Yip. G. Refai-Ahmed, Microelectronics Reliability, vol. 111, 2020.
13. 2020-4. “An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors,” K. Pan, J. Ha, H. Wang, J. Xu, S. Park, IEEE Trans. Components, Packaging and Manufacturing Technol., pp. 161–168, 2020.
14. 2019-1. “The Effect of Solder Paste Volume on Chip Resistor Solder Joint Fatigue Life,” H. Wang, K. Pan, J. Ha, C. Cai, J. Xu, S. Park, Procedia Manufacturing, vol. 38, pp. 1372-1380, Ireland, 2019.
15. 2019-2. “The Effect of Solder Paste Volume on Surface Mount Assembly Self-Alignment,” K. Pan, J. Ha, H. Wang, V. Veeraraghavan, S. Park, Procedia Manufacturing, vol. 38, pp 1381-1393, Ireland, 2019.
16. 2019-3. “Data Driven Prediction Model of Components Shift During Reflow Process in Surface Mount Technology,” I. Parviziomran, S. Cao, V. Veeraraghavan, H. Yang, S. Park, D. Won, Procedia Manufacturing, vol. 39, pp. 100-107, Ireland, 2019.
17. 2019-4. “Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology,” S. Cao, I. Parviziomran, S. Park, D. Won, Procedia Manufacturing, vol. 38, pp. 217-224, Ireland, 2019.
18. 2019-5. “Dynamic Predictive Modeling of Solder Paste Volume with Real Time Memory Update in a Stencil Printing Process,” H. Lu, H. Wang, S. Yoon, D. Won, and S. Park, Procedia Manufacturing, vol. 38, pp. 108-116, Ireland, 2019.
19. 2019-6. “Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology,” I. Parviziomran, S. Cao, H. Yang, S. Park, D. Won, Procedia Manufacturing, vol. 39, pp. 202-209, Ireland, 2019.
20. 2019-7. “Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression,” S. Cao, I. Parviziomran, H. Yang, S. Park, D. Won, Procedia Manufacturing, vol. 39, pp. 210-217, Ireland, 2019.
21. 2018-1. “An Accurate Experimental Determination of Effective Strain for Heterogeneous Electronic Packages with Digital Image Correlation Method,” Y. Niu, V. Pham, J. Wang, and S. Park, IEEE Trans. Components, Packag. Manufacturing Technol., pp. 1–11, 2018.
22. 2018-2. “A Comprehensive Solution for Electronic Packages' Reliability Assessment with Digital Image Correlation Method,” Y. Niu, J. Wang, S. Shao, H. Wang, H.H. Lee, S. Park, Microelectronics Reliability, 2018.
23. 2017-1. “A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method,” Yuling Niu, Huayan Wang, and Seungbae Park, Optics and Lasers in Engineering, Vol. 93, pp. 9-18, 2017. [PDF]
24. 2017-2. “A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization,” Yuling Niu, Shuai Shao, S. B. Park, and Chin-Li Kao, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2017. [PDF]
25. 2017-3. “A Study on Thermo-mechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications,” Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O’Donnell, Dipak Sengupta, and S. B. Park, Sensors, 2017. [PDF]
26. 2017-4. “Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions,” Jing Wang, Ruiyang Liu, Dapeng Liu, and S. B. Park, Microelectronics Reliability, vol. 73, pp. 43-53, 2017. [PDF]
27. 2016-1. “An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system,” Dapeng Liu, Jing Wang, Ruiyang Liu, and Seungbae Park, Microelectronics Reliability, Vol. 60, pp. 109-115, 2016. [PDF]
28. 2016-2. “Prediction of deformation during manufacturing processes of silicon interposer package with TSVs,” Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, and Seungbae Park, Microelectronics Reliability, vol. 65, pp. 234-242, 2016. [PDF]
29. 2016-3. “Moisture diffusion modeling - A critical review,” E. H. Wong, S. B. Park, Microelectronics Reliability, Vol. 63, pp. 318-326, 2016. [PDF]
30. 2016-4. “Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface,” Ah-Young Park, Satish C. Chaparala, and S. B. Park, Microelectronics Reliability, 2016. [PDF]
31. 2015-1. “Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound,” Yeonsung Kim, Dapeng Liu, Hohyung Lee, Ruiyang Liu, Dipak Sengupta, and Seungbae Park, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, Issue 7, pp. 945-955, 2015. [PDF]
32. 2015-2. “Dynamics Behavior of Flat Glass Panels under Impact Conditions: Experiments and Numerical Modeling,” Satish Chaparala, Da Yu, Liang Xue, and Seungbae Park, Journal of the Soc. Of Info. Display, 2015. [PDF]
33. 2015-3. “Integrated hygro-swelling and thermo-mechanical behavior of mold compound for MEMS package during reflow after moisture preconditioning,” Jae B. Kwak and Seungbae Park, Microelectronics International, vol. 32, Issue 1, pp. 8-17, 2015. [PDF]
34. 2015-4. “Development of Inclined Conductive Bump for Flip-Chip Interconnection” Ah-Young Park, Seungbae Park, and Choong D. Yoo, IEEE Transactions on Components, Packaging, and Manufacturing Technology, VOL. 5, NO. 2, FEBRUARY 2015, pp. 207-216. [PDF]
35. 2014-1. “Three-Dimensional and 2.5Dimensional Interconnection Technology: State of the Art,” Dapeng Liu and Seungbae Park, J. of Electronic Packaging, vol. 136, p. 014001, 2014. [PDF]
36. 2014-2. “A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ANSYS 14 and 14.5,” Dapeng Liu and Seungbae Park, J. of Electronic Packaging, vol. 134, p. 034501, 2014. [PDF]
37. 2014-3. “Optimal Material Properties of Molding Compounds for MEMS Packaging,” Yeonsung Kim, Hohyung Lee, Xin Zhang and Seungbae Park, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 4, No. 10, 2014. [PDF]
38. 2014-4. “Development of Inclined Conductive Bump for Flip Chip Interconnection,” Ah-Young Park, Seungbae Park and Choong D. Yoo, IEEE Trans. Of Comp., Packaging and Manufacturing Tech., vol. 5, 2014. [PDF]
39. 2013-1. “Effects of Temperature on Mechanical Properties of SU-8 Photoresist Material,” Soonwan Chung and S.B. Park, J. of Mechanical Science and Technology, vol. 27, no. 9, pp. 2701-2707, 2013. [PDF]
40. 2012-1. “Effect of Shield-Can on Dynamic Response of Board-Level Assembly,” Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, and Ji-Young Yoon, J. of Electronic Packaging, vol. 134, p. 031010, 2012. [PDF]
41. 2012-2. “Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling,” Da Yu, Hohyung Lee, and Seungbae Park, J. of Electronic Packaging, vol. 134, p. 041008, 2012. [PDF]
42. 2012-3. “Review of the F-16 Individual Aircraft Tracking Program,” Hongchul Lee, Hwanjeong Cho, and Seungbae Park, J. of Aircraft, vol. 49, No. 5, pp. 1398-1405, 2012. [PDF]
43. 2012-4. “Transport Phenomena in Proton Exchange Membrane Fuel Cells and Over-potential Distribution of Membrane Electrode Assembly,” Dong-Myung Suh and Seungbae Park, International J. of Thermal Sciences, vol. 51, pp. 31-41, 2012. [PDF]
44. 2011-1. “High-cycle Fatigue Life Prediction for Pb-free BGA under Random Vibration Loading,” Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, and Soonwan Chung, Microelectronic Reliability, vol. 51, pp. 649-656, 2011. [PDF]
45. 2011-2. “Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation,” T.T. Nguyen, D. Yu, and S.B. Park, J. of Electronic Materials, vol. 40, No. 6, pp. 1409-1415, 2011. [PDF]
46. 2011-3. “Characterization of Elasto-plastic Behavior of Actual SAC Solder Joints for Drop Test Modeling,” Tung T. Nguyen and Seungbae Park, Microelectronic Reliability, vol. 51, pp. 1385-1392, 2011. [PDF]
47. 2010-1. “Dynamic Responses of PCB under Product-level Free Drop Impact,” Da Yu, Jae B. Kwak, Seungbae Park, and John Lee, Microelectronic Reliability, vol. 50, pp. 1028-1038, 2010. [PDF]
48. 2010-2. “Estimation of Aircraft Structural Fatigue Life Using the Crack Severity Index Methodology,” Hongchul Lee, Seungbae Park, and Hongon Kim, J. of Aircraft, vol. 47, No. 5, pp. 1672-1678, 2010. [PDF]
49. 2010-3. “Effect of glue on reliability of flip chip BGA packages under thermal cycling,” Tung T. Nguyen, Donggun Lee, Jae B. Kwak, and Seungbae Park, Microelectronic Reliability, vol. 50, pp. 1000-1006, 2010. [PDF]
50. 2009-1. “Three-Dimensional Shape Measurement with a Fast and Accurate Approach,” Z. Wang, H. Du, S. Park, and H. Xie, Applied Optics, vol. 48, No. 6, 1052-1061, 2009. [PDF]
51. 2008-1. “Numerical Investigation of Underfill Failure due to Phase Change of Pb-free Flip Chip Solders during Board Level Interconnect Reflow,” IEEE Trans. On Components and Packaging Technologies, vol. 31, pp. 661-669, 2008. [PDF]
52. 2008-2. “Comparison of Thermo-mechanical Behavior of Lead-Free Copper and Tin-Lead Column Grid Array Package,” S. B. Park and Rahul Joshi, Microelectronics Reliability, vol. 48, pp. 763-772, 2008. [PDF]
53. 2008-3. “Measurement of Transient Dynamic Response of Circuit Boards of a Hand-held Device during Drop using 3D Digital Image Correlation,” S.B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, and James M. Pitarresi, J. of Electronic Packaging, vol. 130, 2008. [PDF]
54. 2008-4. “Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm,” T. Nguyen, N. Goo, V. Nguyen, Y. Yoo, and S. Park, Sens. Actuators A: Physical, vol. 141, pp. 640-648, 2008. [PDF]
55. 2008-5. “Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem”, C. Jang, S. Park, B. Han, and S. Yoon, J. of Electronics Packaging, vol. 130, Issue 1, 2008. [PDF]
56. 2008-6. “Effect of Oxidation in Indium Solderability”, S.B. Park, J. Kim, H. Schoeler, and J. Cho, J. of Electronic Materials, vol. 37, no. 4, pp. 483-489, 2008. [PDF]
57. 2008-7. “Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling,” J. of Electronic Packaging, vol. 130, 2008. [PDF]
58. 2007-1. “Assessment of Packaging Induced Stress on MEMS Devices Performance”, Sam Zhang, S.B. Park, and Michael Judy, J. of MEMS, vol. 16, No. 3, pp. 639-649, 2007. [PDF]
59. 2007-2. “Predictive Model for Optimized Design Parameters in Flip-Chip Packages”, S.B. Park, H.C. Lee, B. Sammakia, and K. Raghunathan, IEEE Trans. on Components and Packaging Technologies, vol. 30, No. 2, pp 1-8, 2007. [PDF]
60. 2007-3. “Effects of Phase Change of Pb-free Flip-Chip Solders during Board Level Interconnect Reflow Underfill Flows”, S. Chung, Z. Tang, and S.B. Park, IEEE Trans. on Advanced Packaging, vol. 30, No. 1, pp 38-43, 2007. [PDF]
61. 2007-4. “Measurement of Deformations in SnAgCu Solder Interconnects Under In-situ Thermal Loading”, S.B. Park, Ramji Dhakal, L. Lehman and E. Cotts, Acta Materialia, vol. 55, No. 9, pp. 3253-3260, 2007. [PDF]
62. 2007-5. “Grain Deformations and Strains in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling”, S.B. Park, Ramji Dhakal, L. Lehman and E. Cotts, IEEE Trans. on Components and Packaging Technology, vol. 30, No. 1, pp 178-185, 2007. [PDF]
63. 2007-6. “Shorter Field Life in Power Cycling for Organic Packages”, S.B. Park and I. Ahmed, J. of Electronic Packaging, vol. 129, pp. 28-34, 2007. [PDF]
64. 2006-1. “A Model of Shear Viscosity for Underfill Flows”, R. Yang, DC Sun, and S.B. Park, J. of Electronic Packaging Materials, vol. 35, No. 11, pp.2016-2025, 2006. [PDF]
65. 2006-2. “Effect of Settlement on Dense Slurry Flow in a Horizontal Channel”, R. Yang, DC Sun, and S.B. Park, J. of Electronic Packaging Materials, Vol. 35, No. 11, pp 2026-2034, 2006. [PDF]
66. 2006-3. “Material Characterization of Carbon-Nanotube-Reinforced Polymer Composite”, S. Chung, S. Makhar, H. Ackler, and S. Park, Electronic Materials Letters, Vol. 2, No. 3, pp 175-181, 2006. [PDF]

 

Book Chapters

1. “Modeling, Simulation and Design Tools”, Sanjeev Sathe and S.B. Park, 2007 iNEMI Roadmap, International Electronics Manufacturing Initiative, Inc., Herndon, VA, 2007.
2. “Modeling, Simulation and Design Tools”, Sanjeev Sathe and S.B. Park, 2004 iNEMI Roadmap, International Electronics Manufacturing Initiative, Inc., Herndon, VA, 2004.