Faculty
Dr. Seungbae Park (CV) Department Page |
Students
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Karthik Deo | Ph.D.Student |
| Jong Hwan Ha | Ph.D.Student | |
| Yangyang Lai | Ph.D. Student | |
| Junbo Yang | Ph.D. Student | |
| Zachary Sloan | MS.Student |
Faculty
Dr. John HC Lee Retired (2011) |
Graduates
Graduates of the Opto-Mechanics and Physical Reliability Lab are employed by the top companies in industry such as Amazon, Apple, Corning, Intel, Micron, Microsoft, and Samsung, etc. Our students also receive internship oppptunity from those top companies.
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Izhar Ahmed | M.S., 2004 | Apple Inc. |
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Ganesh Iyer | M.S., 2004 | Cisco |
| Rahul Joshi | M.S., 2004 | Hewlett-Packard | |
| Karthik Raghunathan | M.S., 2005 | Corning | |
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Chirag Shah | M.S., 2007 | Apple Inc. |
| Aaron Reichman | M.S., 2007 | Intel Corp. | |
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Khalid Umar | M.S., 2007 | Raytheon |
| Kyung-Taik Park | M.S., 2008 | Korea | |
| Hyojeong Jeon | M.S., 2009 | Lecturer in College Prep School | |
| Dong Gun Lee | M.S., 2009 | Korea Inst. Of Machinery | |
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Claire R. Coble | M.S., 2013 | Corning |
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Quang H. Nguyen | M.S., 2013 | Micron |
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Rohit V. Bhosle | M.S., 2013 | DePuy Synthes, part of the Johnson & Johnson family of companies |
| Jung Hoon Baek | M.S., 2016 | Korean Air Force | |
| Zhenming Tang | Ph.D., 2008 | ||
| Thesis: Interfacial reliability of lead-free flip-chip BGA package | |||
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Ramji Dhakal | Ph.D., 2009 | Microsoft |
| Thesis: Microstructure based experimental and finite element analysis of failure mechanism of lead-free BGA interconnects | |||
| Hongchul Lee | Ph.D., 2010 | Aero Tech. Res. Inst., Korean Airforce | |
| Thesis: Advanced aircraft service life monitoring method via flight-by-flight load spectra | |||
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Abdullah Al-Yafawi | Ph.D., 2010 | Cobham Mission Systems |
| Thesis: Electronic packages fatigue life predicion under random vibration loading conditions | |||
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Tung T. Nguyen | Ph.D., 2010 | Microsoft |
| Thesis: Characterization of the elasto-plastic behavior of actual tin silver copper solder joints using DIC | |||
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Jae B. Kwak | Ph.D., 2010 | Samsung |
| Thesis: Experimental assessment of electronic package deformation using optical full-field deformation measurement system | |||
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Haojun Zhang | Ph.D., 2010 | GlobalFoundries |
| Thesis: Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages | |||
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Dongmyung Suh | Ph.D., 2011 | Pacific Northwest National Lab |
| Thesis: Numerical modeling transport phenomena in proton exchange membrane fuel cells | |||
| Hoyong Lee | Ph.D., 2012 | L. Colonel, Korean Airforce | |
| Thesis: Avionics reliability assurance guidelines for high altitude applications | |||
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Da Yu | Ph.D., 2012 | Apple Inc. |
| Thesis: Fatigue life assessment and prediction of ball grid array package under environmental conditions | |||
| Seil Baek | Ph.D., 2012 | L. Colonel, Korean Airforce | |
| Thesis: Flight-by-flight stress spectrum development methodology for aircraft structural life assessmentns | |||
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Yeonsung Kim | Ph.D., 2014 | Qualcomm |
| Thesis: Stress and deformation minimization of MEMS sensor package and TSV interposer package | |||
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Liang Xue | Ph.D., 2014 | |
| Thesis: Dynamic behavior of a tempered glass under impact | |||
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Dapeng Liu | Ph.D., 2015 | Microsoft |
| Thesis: Packaging-induced stresses on microelectromechanical systems | |||
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HoHyung Lee | Ph.D., 2016 | Apple Inc. |
| Thesis: Investigation of the time dependent property for packaging materials | |||
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Yuling Niu | Ph.D., 2017 | Qualcomm |
| Thesis: The Development of Digital Image Correlation Method for Electronic Packaging Reliability Assessment | |||
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Ah-Young Park | Ph.D., 2017 | Corning |
| Thesis: Thermo-mechanical problems and their solution in a 3D micro-electronics package using Cu-to-Cu direct bonding | |||
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Charandeep Singh | Ph.D., 2018 | Corning |
| Thesis: Dynamic Fracture of Brittle Materials | |||
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Jing Wang | Ph.D., 2018 | Apple Inc. |
| Thesis: A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging | |||
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Shuai Shao | Ph.D., 2018 | AMD |
| Thesis: Fast Prediction for Board-level Reliability of Interconnect in Electronic Packaging | |||
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Huayan "Andy" Wang | Ph.D. 2019 | Apple Inc. |
| Thesis: Advances of 2D Micro Digital Image Correlation and Its Usage in Chip Packaging Interaction Analysis | |||
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Van Lai Pham | Ph.D. 2020 | Samsung |
| Thesis: Plastic strain analysis and reliability study of BGA solder joint with Digital Image Correlation technique | |||
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Ruiyang Liu | Ph.D. 2020 | Apple Inc. |
| Thesis: Aging of Polymer Materials and Its Reliability Impacts to 2.5D Electronics Packaging | |||
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Jiefeng Xu | Ph.D. 2020 | Apple Inc. |
| Thesis: Electromigration Assessment and Prediction in 2nd Level Ball Grid Array | |||
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Ke Pan | Ph.D. 2022 | Apple Inc. |
| Thesis: Thermomechanical Reliability and Constitutive Investigation of Copper Through-Glass Via in Glass Interposer | |||
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Chongyang Cai | Ph.D. 2022 | Intel |
| Thesis: Evaluation of Reliability of Low Melting Temperature Sn-Bi Solder | |||
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Pengcheng Yin | Ph.D. 2023 | AMD |
| Thesis: ##### | |||
Post-Doctoral Fellows
| Soonwan Chung | 2005-2007 | Samsung Electronics | |
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Changsoo Jang | 2006-2007 | |
| Jongman Kim | 2006-2007 | Samsung Electric | |
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Jia Gao | 2005-2006 | Cirrus Logic |
| |
Shijun Yu | 2014 | Amazon |
The thesis or dissertations of the group members can be found in the ProQuest Digital Dissertations database.
Last Updated: 5/8/2018
