A Novel Coating Concept for Electronic and MEMS Packaging

(co-funded by Semiconductor Research Corporation & Microelectronics Design Center)

Ceramic Thin Film Embedded Capacitors for Emerging System-in-Packaging (SIP) Concepts

(funded by New York State Office of Science, Technology and Academic Research)

Electronic Packaging Materials for Deep Drilling Technologies

(funded by General Electric / Department of Energy)

Design, Packaging and Reliability of MEMS S&A Components - Materials Characterization

(funded by Office of Naval Research)

Utilization of Dynamic Nanoindentation for Soft Materials

(funded by Integrated Electronics Engineering Center)

Oxygen and Moisture Barrier Coatings for Organic Electronics

(funded by Center for Advanced Microelectronics Manufacturing / US Army)