of our research activities in
materials and mechanics disciplines.
Below are our current research supports:
Novel Coating Concept for Electronic and MEMS
by Semiconductor Research Corporation & Microelectronics Design Center)
Thin Film Embedded Capacitors for Emerging System-in-Packaging
by New York State Office of Science, Technology and Academic Research)
Packaging Materials for Deep Drilling Technologies
by General Electric / Department of Energy)
Packaging and Reliability of MEMS S&A Components - Materials Characterization
by Office of Naval Research)
of Dynamic Nanoindentation for Soft Materials
by Integrated Electronics Engineering Center)
and Moisture Barrier Coatings for Organic Electronics
by Center for Advanced Microelectronics Manufacturing / US Army)
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