Ceramic Thin Film Embedded Capacitors for Emerging System-in-Packaging (SIP) Concepts

Junghyun Cho, Biplab K. Roy^*, Guangneng Zhang^*, and Bahgat Sammakia
State University of New York (SUNY), Binghamton, New York 13902-6000

Mark D. Poliks and Roy H. Magnuson
Endicott Interconnect Technologies, Inc., Endicott, New York 13760

^*Graduate student

Overview:

As electronic circuit boards become crowded with numerous discrete components, additional advances will require utilization of the inner spaces of electronics packaging for embedded component placement.  The embedding of the passive components inside packaging is starting to emerge in the industry as the process effectively combines manufacturing, component packaging and component assembly into a single manufacturing process flow. This embedded technology can thus achieve size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability.

Endicott Interconnect Technologies, Inc. (EI) and The State University of New York at Binghamton (Binghamton University) have leveraged extensive expertise and research background in electronics packaging, new materials development, processing for small scale systems.  In this joint project, new, high performance passive devices will be created for emerging system-in-packaging (SIP) concepts that tackle the above concerns.  SIP promises a new frontier for the interconnect and electronics packaging industry.  It builds on a well-established manufacturing infrastructure and creates value by making the package platform of choice for small-scale systems integration.

Specifically, ceramic thin films of high capacitance materials will be embedded within the inner layers of electronic packages and will replace the need for placement and assembly operations of discrete surface mounted components.  This project will examine high-k dielectric materials and their microstructures will be tailored to enhance electrical performance. The proposed ceramic films have several advantages over existing ceramic-filled epoxy or ceramic paste dielectrics:

• In-situ deposition procedure in aqueous solution
• Better dielectric performance (e.g., higher dielectric constant and strength)
• Very low processing temperatures (< 100°C)
• Tunable dielectric constant (through thickness and microstructure controls)
• Micro-patterning capability

Anticipated Impacts:

It is intended to design and develop a new paradigm of the embedded capacitor for emerging system-in-packaging (SIP) concepts using innovative ceramic thin film processing.  Commercialization of the product will be an ultimate goal of this 2-year prototype product development. The proposed program is performed through a collaborative effort between BU and EI who have already launched several joint projects in recent years. BU team will also work closely with the office of the Technology Transfer and Innovation Partnerships (TTIP) at BU to bring the proposed innovative research to commercialization stages. 

In addition, EI has well established business relationships with NY State’s leading technology corporations.  Through these partnerships and joint-development arrangements there is a potential to provide a significant source of revenue for a variety of hardware related markets located in New York State.  As stated above, applications of the embedded capacitor technology will advance the state-of-the-art in miniaturized electronics, sensors and communications that are vital to the success of U.S. armed forces. 

Support for this project is provided by New York State Office of Science, Technology and Academic Research (NYSTAR). BU and EI have matched additional funding for this project.